Produktai skirti hynio atmintis (5)

HYDRONYLON ® HP (BITUMEN PAD)

HYDRONYLON ® HP (BITUMEN PAD)

Used to make filling primers for HYDRONYLON ® HN on bituminous felt substrates. CONSUMPTION: 2 kg/m 2 – using SW-1 technical mesh APPLICATION: Apply the first layer of HYDRONYLON ® HP on the prepared substrate using a brush or broom . After the first layer has dried, apply the second layer of HYDRONYLON ® HP through a SW-1 technical mesh (it is also permissible to apply the first layer of HYDRONYLON ® HP directly on the prepared substrate through a SW-1 technical mesh). The base coat should be made in at least two layers. PACKAGING:25 kg COLOUR:Grey
V-Link

V-Link

Our enclosed module featuring an internal power supply and printhead driver board, enables communication between the DOD printhead technology and the MPERIA controller through an Ethernet connection. V-Links can be stacked and networked through MPERIA®, providing a flexible and scalable system for small or very large applications.
Digimetrinis

Digimetrinis

The DigiMetric photogrammetric system is a new type of 3D measurement equipment and known as a new generation of optical digital coordinate measuring machine, which is widely used in large and heavy equipment manufacturing industries such as automotive, aerospace, power generation equipment and engineering machinery, and has marked a new era in the field of largesize workpiece rapid 3D measurement technology. Accuracy:0.01mm+0.01mm/m
Simfonijos Programinė Įranga - IT ir Programinė Įranga

Simfonijos Programinė Įranga - IT ir Programinė Įranga

Le logiciel Symphony™ est une application client/serveur qui est déclenchée par une acquisition MassLynx® et permet l'automatisation d'une ou plusieurs fonctions de manipulation ou de traitement de données dans une séquence. Il est conçu dans un souci d'efficacité, de flexibilité et de créativité et permet aux laboratoires d'extraire le maximum de valeur de l'instrumentation LC-MS.
Procesų Technologija

Procesų Technologija

Cleaning of machined parts (after turning, milling, drilling, etc.). Particularly suitable for the removal of graphite, AW and EP additives, salts, soaps, and emulsion residue. Generally suitable for the removal of dust, metal chips, surfactants, stearates and polishing paste. Preparation of parts for downstream processing such as joining (by clinching, etc.), assembly and packaging. Cleaning of machined parts (after turning, milling, drilling, etc.). Particularly suitable for the removal of grease, oil, wax, resins, corrosion protection agents and esters. Generally suitable for the removal of dust, metal chips, surfactants, stearates and polishing paste. Preparation of parts for downstream processing such as joining (by clinching, etc.), assembly and packaging. Cleaning of machined parts after turning, milling or drilling, grinding, polishing, lapping and honing, punching and forming (stamping & bending, deep drawing, extruding, etc.).